English
MailboxProduct Information
View other applications
IC and Modules Application
1Function application
Supports highly integrated or small-sized IC and modules, such as PA, SIP packaging, etc.
2Product Features
Related Product Series
Multilayer Ceramic Chip Capacitors for General Use (C series)
High-Q Multilayer Ceramic Chip Capacitors (C Series -HQC)
High-Q Multilayer Ceramic Chip Capacitors (U Series)
C series Product Features
The mainstream packaging size is ultra-miniature size such as 01005 (0.4*0.2mm), 008004 (0.25*0.125mm), which meets the market trend of miniaturization and high integration, and reduces the loop impedance of peripheral circuits
Typical Specifications of C Series
008004-C0G-0.5pF-±0.1pF-16V
008004-X5R-22nF-±5%-4V
01005-C0G-33pF-±5%-25V
01005-X7R-1nF-±10%-25V
C Series -HQC & U Series Product Features
It can effectively improve the signal transmission efficiency of radio frequency circuits, reduce reflection loss, and enhance processing capabilities
Typical Specifications of C Series-HQC & U Series
01005-High Q-C0G-0.5pF-±0.1pF-25V
01005-High Q-C0G - 3.3pF-±0.05pF-25V
0201-High Q-C0G - 4.7pF-±0.1pF-25V
0201-High Q-C0G - 10pF-±2%-25V
